Rumors have recently suggested that Xiaomi Mi7 will be among the first phones to sport the Snapdragon 845 SoC by Qualcomm (the first after Samsung Galaxy S9), but it seems it will not be powerful as expected. According to new voices, Qualcomm will release the chipset before the end of 2017 and this SoC could be its second generation chipset made with a production process at 10 nm. Even though rumors claimed that it would be built with 7 nm FinFET technology, it seems it will not be so. Qualcomm has declared that Snapdragon 836 does not exist, but the company has never excluded a possible launch of a new flagship processor with 10 nm FinFET technology in 2017.
Qualcomm Snapdragon 835 has been announced in November 2016, almost a year ago, but even if one year has passed, besides the fact that there was not any Snapdragon 836 (while in 2016 we saw Snapdragon 820 and 821, two flagship SoCs), it seems that Qualcomm Snapdragon 845 will not be much more powerful than the 835. Anyways, the processor is expected to come with updated Kryo cores and not with ARM Cortex ones (so we will see the custom cores by Qualcomm instead of third party ones). It should have an Adreno graphics processing unit optimized for augmented reality, machine learning and virtual reality.
Expect advanced AI capabilities as well, since this SoC may have a Neural Processing Unit. Or at least, Kirin 970 by Huawei and A11 Bionic by Apple have an NPU, so we expect to see it on Snapdragon 845 too. Xiaomi Mi7 is tipped to come with a bezel less display that will have a Quad HD+ resolution and maybe the OLED technology. Together with the SD845 there may be 6 or even 8 GB of RAM, supported by 64 or more GB of internal storage. Expect a dual camera and a pretty big battery as well.