Qualcomm Snapdragon 845 will be the next flagship SoC made by Qualcomm for smartphones, and Xiaomi Mi7 will be one of the first devices to sport it under the hood. According to new rumors coming from the microblogging platform Weibo, Qualcomm is actually optimizing the new chipset for the next flagship by Xiaomi. We are talking about an industry insider and not about official info, so take all the rumors with a pinch of salt. According to the leakster, the testing of the processor on the phone will begin in November this year, while the final testing phase may take place in February next year.
Unlike the previous year, in 2017 we did not see two flagships SoCs launched by Qualcomm. While in 2016 there were Snapdragon 820 and Snapdragon 821, in 2017 we only saw Snapdragon 835. This means that Qualcomm is putting many more efforts at making the SoC for Xiaomi Mi7, Samsung Galaxy S9 and the other best flagships that will come in 2018. According to voices, Snapdragon 845 will not be composed of Kryo custom cores, but there will be ARM Cortex A75 cores supported by an Adreno 630 graphic processing unit.
There will also be an X20 LTE modem supporting incredible speeds up to 1.2 Gbps. Regarding Xiaomi Mi7, it is expected to come with a rear side made of ceramic and glass, and a profile made of metal. Together with Snapdragon 845 we will see at least 6 GB of RAM in its specs sheet, and there should be an OLED display as well. Even if Qualcomm and Vivo have recently announced an in-screen fingerprint reader technology, it is unlikely that we will see it on the Mi7. The price of the phone should be 2,999 Yuan in China, which is much lower than the price expected for Samsung Galaxy S9 and the other flagships from non-Chinese brands.